3D Segmentation of Brain Tumor using Deep Learning
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Summary
Utilized deep learning techniques to segment brain tumors from 3D MRI scans, aiming to provide precise medical imaging analysis.
Highly motivated Electronics and Communications Engineering student with a strong academic record (CGPA 8.1) and practical experience in AI/Machine Learning, Deep Learning, and Embedded Systems. Eager to leverage expertise in Python, C, Java, and TensorFlow to develop innovative solutions and contribute to cutting-edge technological advancements in a dynamic engineering environment.
VLSI Intern
Guntur, Andhra Pradesh, India
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Summary
Gained hands-on experience in Very Large Scale Integration (VLSI) design and methodologies through practical projects and industry insights, enhancing foundational knowledge in chip architecture.
Highlights
Applied theoretical knowledge to practical VLSI design challenges, contributing to foundational understanding of chip architecture and development workflows.
Explored industry-standard tools and processes for integrated circuit design, improving proficiency in a core area of electronics engineering.
Collaborated on small-scale design tasks, developing problem-solving skills within a professional engineering context.
Workshop Participant (Embedded System Application Development)
Guntur, Andhra Pradesh, India
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Summary
Developed applications for embedded systems, focusing on hardware-software interaction and real-time programming within a structured workshop environment.
Highlights
Gained practical experience in embedded C programming and microcontroller interfacing, strengthening capabilities in IoT and automation projects.
Implemented basic embedded system applications, demonstrating understanding of firmware development and hardware control.
Acquired hands-on skills in debugging and optimizing code for resource-constrained embedded platforms.
Workshop Participant (PCB Design)
Guntur, Andhra Pradesh, India
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Summary
Acquired fundamental skills in Printed Circuit Board (PCB) design and fabrication through an intensive workshop, covering layout and component integration.
Highlights
Mastered PCB layout techniques and component integration, enhancing practical skills for hardware development and prototyping.
Designed functional circuit boards, applying principles of electrical engineering and manufacturing considerations.
Utilized industry-relevant software for schematic capture and PCB routing, improving proficiency in electronic design automation tools.
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B.Tech
Electronics and Communication Engineering
Grade: CGPA: 8.1
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Intermediate
MPC Stream
Grade: CGPA: 9.3
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SSC
General Studies
Grade: CGPA: 10
Issued By
MicroLink Information Technologies
Issued By
APSCHE-Blackbucks IIDT Internship
Issued By
MicroLink
Issued By
Infosys Spring Board
Issued By
NPTEL
Issued By
Infosys Spring Board
Issued By
Arm education
Issued By
Udemy
C, Java, Python.
MySQL.
Oracle HCM Cloud Fusion.
Scikit-learn, Pandas, NumPy, TensorFlow, Jupyter Notebook.
Unet Architecture, Keras, OpenCV, Matplotlib.
Arduino, Sensors, WiFi ESP8266, LED, Buzzer.
Playing Cricket.
Travelling.
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Summary
Utilized deep learning techniques to segment brain tumors from 3D MRI scans, aiming to provide precise medical imaging analysis.
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Summary
Developed an AI-powered system to detect fraudulent online transactions using advanced machine learning algorithms.
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Summary
Designed a prototype smart cap to promote social distancing during the pandemic by integrating various sensors and an alert system.